This is a multi-target sputter deposition system for synthesizing magnetic thin films. This tool is located in the MRL central facilities in room 336 MRL.
The Bruker D8 Advance diffractometer includes a vertical theta/theta goniometer with independent rotation of the x-ray tube, x-ray detector, sample stage tilt and spinning. All major x-ray diffraction (XRD) and reflectivity (XRR) applications are available in this system.
The Electron Microscope Pixel Array Detector (EMPAD) is a pixelated detector for applications as 4D STEM acquiring diffraction pattern in each point of a map at a speed of up to 1,100 diffraction patterns per second.
Multi-chamber glove box with an in-situ microscope, 2D material transfer station, spinner and thermal evaporator. This integrated system allows for the manufacture of ultra-clean 2D heterostructures and devices and working with air-sensitive nanomaterials.
The XploRA PLUS Raman Microscope head-based tip-enhanced Raman spectroscopy (TERS) and tip enhanced photoluminescence (TEPL) from Horiba, Inc. is a fully integrated TERS/TEPL system based on SmartSPM state of the art scanning probe microscope (SPM) and XploRA Raman micro-spectrometer.
The NT-MDT AFM has built in all the standard scanned probe measurement capabilities including topography imaging, nanomechanical indentation and shear, and electrical imaging. It is primarily used for topography analysis of 2D materials and testing the cleanliness of 2D heterostructures.
The Plasma Etch is a 25 W direct oxygen plasma system primarily used for etching 2D materials and cleaning polymer residue from dirty samples.
The Quantum Design MPMS3 is a third-generation Magnetic Property Measurement System (MPMS) which uses a Superconducting Quantum Interference Device (SQUID) to measure the bulk magnetic moment of samples with < 10-8 emu sensitivity.
The Quantum Design MPMS3 is a third-generation Magnetic Property Measurement System (MPMS) which uses a Superconducting Quantum Interference Device (SQUID) to measure the bulk magnetic moment of samples with < 10-8 emu sensitivity.
The Tergeo Plasma Cleaner is capable of direct or indirect oxygen or hydrogen plasmas. It is primarily used for chemical modification of 2D material surfaces, e.g. oxidization of chalcogenides or hydrogenation of graphene.
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